A row of precision probes moves slowly under a microscope, aiming at the gold wire solder joints on the chip, finer than a human hair. With a slight mechanical sound, a precise and controllable pulling force is applied to the solder joint—0.02 Newtons, the solder joint remains intact; 0.05 Newtons, the solder joint remains strong; only at 0.1 Newtons does the solder joint break.
It is under such stringent quality control requirements that push-pull force testers have become an indispensable key testing device in the field of microelectronics manufacturing.
01 Core Function: Six-in-One Automatic Rotating Module Design
The most striking feature of the WBE-9088B push-pull force tester is its six-in-one automatic rotating module design. This innovative design allows for the simultaneous configuration of sensors of different types and ranges, automatically switching according to testing needs without manual sensor replacement.
This design provides unprecedented flexibility. Users can freely combine testing capabilities based on actual testing requirements: a "3-pull 3-push" configuration (3 tension sensors and 3 push sensors); a "1-pull 5-push" configuration (1 tension sensor and 5 push sensors); or even a "6-push" configuration for full push force testing.
The equipment is equipped with a high-definition 1-60x zoom microscope system and an optional high-definition CCD camera, ensuring operators can clearly observe minute test objects. With an XY axis travel of 100mm × 100mm and a Z-axis travel of 75mm, a resolution of up to 0.1 micrometers, and a positioning accuracy of ±5 micrometers, it fully meets the precision positioning requirements of microelectronics manufacturing.
02. Versatile Applications, Covering the Entire Electronics Manufacturing Field
The WBE-9088B push-pull force testing machine has an extremely wide range of applications, covering multiple high-tech fields from semiconductors to aerospace.
In semiconductor manufacturing, it can test the bonding strength of chips and packages, ensuring the stable operation of integrated circuits under various environments. In the electronics manufacturing field, it is used to evaluate the soldering strength of circuit boards and connectors, preventing electronic products from failing due to poor soldering.
In the aerospace field, it can test the connection strength of spacecraft components, ensuring the reliability of critical components in extreme environments. This equipment is also widely used in automotive manufacturing to test the soldering strength of automotive parts, ensuring the safety of automotive electronic systems.
Specifically, the equipment can perform various types of mechanical tests: tensile testing of bonding materials such as leads, gold wires, copper wires, alloy wires, aluminum wires, and aluminum strips; push testing of gold balls, copper balls, solder balls, wafers, chips, and surface-mount components; and shear force testing of micro-solder joints, ball-mounted components, wafers, chips and substrates, and BGAs.
03 Technical Advantages, Precise and Reliable Mechanical Testing Platform The WBE-9088B push-pull force tester from
WBE demonstrates superior technical performance, providing a series of impressive technical specifications.
The equipment's overall testing accuracy reaches ±0.1%, ensuring high reliability of test results. With a maximum XY-axis speed of 7mm/s and a maximum Z-axis speed of 10mm/s, the WBE-9088B push-pull force testing machine improves testing efficiency while ensuring accuracy. The maximum Y-axis testing force is 200kg (500kg optional), and the maximum Z-axis testing force is 20kg (50kg optional), covering a full range of testing needs from tiny solder joints to larger components.
The equipment employs VPM vertical positioning technology and automatic rotary positioning technology to ensure that the test probes are accurately positioned at the test points. Simultaneously, the equipment also features intelligent safety protection functions to prevent damage to the equipment or test samples due to misoperation.
Webang has also custom-designed various precision fixtures and testing tools (consumables) for this equipment to ensure that test objects of different shapes and sizes can be securely fixed and accurately tested.
04 Strict Standards, Meeting Global Industry Standards
The WBE-9088B push-pull force testing machine strictly adheres to the testing specifications of multiple authoritative global standards organizations, ensuring its test results have international recognition.
The equipment meets the following standards:
Chip shear force: Complies with MIL-STD-883 and IPC-TM-650 standards
Ball solder shear force: Complies with ASTM-F1269, MIL-STD-883, and JEDEC JESD22-B116B standards
Gold ball shear force: Complies with JEDEC JESD22-B116, JESD22-B117B, and JEITA ET-7409 standards
Lead/bond pull force: Complies with MIL-STD-883 and IPC-TM-650 standards
Flat pull force: Complies with MIL-STD-883 standard
Flip chip pull force: Complies with JEDEC JESD22-B109 standard
These standards cover the main testing requirements of the microelectronics industry, including specialized tests such as cold/hot ball pull force and BGA copper pillar shear force. This feature is particularly important for companies that need to provide test reports to international customers.
05 Specifications and Configurations, Comprehensively Meeting Testing Needs
The WBE-9088B push-pull force testing machine offers complete hardware configurations and flexible optional solutions to meet the specific needs of different users.
Regarding sensors, the equipment offers multiple measurement ranges:
- Push force test sensors: 10 specifications from 250g to 500kg
- Tension force test sensors: 10 specifications from 25g to 50kg
- Pull-out force test sensors: 6 specifications from 100g to 20kg
- Downward pressure test sensors: 6 specifications from 100g to 50kg
This configuration covers the full range of testing needs, from micro-wire bonding to large BGA packaging.
Regarding the software system, the equipment comes with a built-in computer, pre-installed with Windows 11 operating system, equipped with a display screen, and features real-time data saving and export capabilities, facilitating data analysis and report generation for users.
The equipment also supports vacuum adsorption for sample fixation (550 mm Hg vacuum supply) and requires 4.5~6 Bar compressed air as a power source, ensuring the stability of the testing process.
With the real-time generation and storage of test data, the quality defense line for batches of electronic products is imperceptibly strengthened. From consumer electronics to aerospace, from LED lighting to optical communications, this six-module push-pull force tester is safeguarding the reliability of microelectronic products worldwide.