WBE-MJ630L Mold Test Chamber: This chamber is used to test the equipment's resistance to mold and whether it is adversely affected by mold growth under conditions conducive to mold growth (i.e., high humidity, warmth, and the presence of inorganic salts). Based on the study of the effects of two different groups of test fungi on major non-metallic materials in GJB150A-2009 "Environmental Testing Methods for Military Equipment - Mold Test Methods", this chamber analyzes and demonstrates the differences in the degree and grade of mold growth in test pieces of the same material under the same coating and processing techniques.
The fungal strains include:
*Aspergillus niger* AS3.3928, *Penicillium flocculatum* AS3.3875, *Aspergillus terreus* AS3.3935, *Penicillium wansii* AS3.4253, *Trichoderma viride* AS3.2942, *Penicillium ochreum* AS3.4302, *Brucea buddinga* AS3.3984, *Brucea sclerotiorum* AS3.3985.
Test Standards:
1. GJB150.10A-2009 Damp Heat Test Method
2. GBT 2423.16-2008/IEC6008-2-10:2005 Mold Growth Test Method
3. GJB 150.10A-2009 Mold Test
4. GB/T 10588-2006 Technical Conditions for Mold Growth Test Chamber
5. GB-T5170.18-2005 Verification Methods for Basic Parameters of Environmental Testing Equipment for Electrical and Electronic Products: Temperature/Humidity Combined Cyclic Test Equipment
6. GB-T10586-2006 Technical Conditions for Damp Heat Test Chamber
7. HB 6167.11-1989 Environmental Conditions and Test Methods for Airborne Equipment of Civil Aircraft: Mold Test
8. GJB4.10 Environmental Testing of Shipboard Electronic Equipment: Mold Test
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