WBE Bond Strength Tester Machine is a critical piece of equipment for quality control and failure analysis in the microelectronics and semiconductor packaging industry. Its core task is to precisely measure the connection strength of micron-level solder joints and wires, ensuring that every "solder joint" on the chip or circuit board is secure and reliable.
Bond Strength Tester Machine is widely used in microelectronics industry & semiconductor packaging for failure analysis and reliability testing. Such as wire welding strength test after microelectronic wire bonding, solder joint and substrate surface adhesion test, solder ball repetitive thrust fatigue test (inner lead pull test, micro solder joint thrust test, gold ball thrust test, chip shear force test, SMT welding component thrust test, BGA matrix overall thrust test).
Application field:
Bond Strength Tester Machine Test field:
Test standards:
Product features:
1. Performs wire pull tests on gold and aluminum wires, bond shear tests on gold and aluminum ball bonds, die shear tests on chip attachments, shear tests on PCB-mounted resistors and capacitors, ball shear tests on BGA solder balls, push-off tests on BGA components, and lead shear tests on QFP pins.
2. With bond wire strength tension test (WP), solder joint thrust test (BS), solder chip shear test (DS), down force test (DP), pull-out force (TP), etc.,
3. Each sensor is equipped with an independent anti-collision overload protection system to prevent accuracy deviation caused by operational errors.
4. The fixture can be heated to meet specific test requirements.
