WBE-9088B / Wire Bond Strength Tester Machine

Wire Bond Strength Tester  Machine also known as push-pull testers and bond strength testers, are widely used in the microelectronics industry and semiconductor packaging for failure analysis and reliability testing. They can perform bond wire tensile testing, solder joint push testing, and chip shear testing, switching between destructive and non-destructive testing. They are essential dynamic mechanical testing instruments for bonding, SMT, and microelectronics manufacturing.Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.

1. Solder Strip Pull Test – Various hooks, clamps, and other load-bearing tools can test samples of various sizes and types.
2. Hot-Pulse/Pin Pull Test – Tests PCB materials and low-profile solder bumps.
3. Copper Wire First Solder Ball Pull Test, Chip Shear Force, Copper Pillar Bump Pull Test – Custom-designed pull clamps can perform tear-pull force tests at this critical connection point.
4. Tensile-Shear-Force Fatigue Test – Fatigue analysis is becoming an increasingly important method for evaluating solder joint reliability. Adjusting the software and hardware allows for          fatigue testing in both tensile and shear force modes.
5. Passivation Layer Shear Test – Solder ball shear force testing can be performed using software and specific load-bearing tools, without being limited by the passivation layer.

Test Standards:

Wire Bond Strength Tester Machine Features:
1. Ribbon Pull Test - A variety of hooks, jaws, and other load tools allow testing of various sample sizes and types.
2. Hot Bump/Needle Pull Test - Tests printed circuit board materials and low-profile solder bumps.
3. Copper Wire First Bump Pull, Wafer Shear, and Copper Pillar Bump Pull Test - Customized pull jaws enable tear testing of these critical connections.
4. Tension-Shear Fatigue Test - Fatigue analysis is becoming an increasingly important method for assessing solder joint reliability. Adjustable software and hardware enable fatigue testing in both tension and shear modes.
5. Passivation Layer Shear Test - Software and specialized load tools enable solder ball shear testing, regardless of passivation layer limitations.

Wire Bond Strength Tester Machine Specification：