PCB Large Sample Bond Tester Machine

WBE-9088C/PCB Large Sample Bond Tester Machine

PCB Large Sample Bond Tester Machine also known as the large-size, long-stroke push-pull force testing machine, features a large stroke, high precision, and automatic rotating module changing. It is suitable for push-pull force testing, solder strength shear force testing, downward pressure testing, and pull-out force testing of large-size PCBs, mini panels, and large-size samples. It is an important dynamic mechanical testing instrument for bond processes, SMT processes, bonding processes, and microelectronics manufacturing.

Contact

Description

WBE-PCB Large Sample Bond Tester Machine is widely used in semiconductor packaging, optical communication device packaging, LED packaging, and military equipment products or components for failure analysis and reliability testing.Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.

Test standards:

PCB Large Sample Bond Tester Machine Features:
1. The XYZ axis boasts an ultra-large travel range of 500*500*100mm, enabling full tensile and shear (push) testing of large PCBs, mini panels, and large specimens.
2. Capable of testing bond wire tensile (WP), solder joint push (BS), chip-to-substrate shear (DS), downforce (DP), and pullout (TP).
3. An all-in-one, automatic rotating module exchange allows for selection of 1 to 6 modules (push, shear, tension, pullout, and downforce) individually or in combination.
4. Each sensor features an independent anti-collision and overload protection system to prevent accuracy deviations due to operational errors.
5. Customizable precision fixtures and test tools (consumables) are available.

PCB Large Sample Bond Tester Machine Specification

Test Range
Force Transducers - Shear Testing (Ball/Die)					Force Transducers - Push Testing (Ball/Die)
Transducer	Auto Range				Transducer	Auto Range
□ BS250G	250g	100g	50g	25g	□ WP25G	25g	10g	5g	2.5g
□ BS1KG	1kg	500g	250g	100g	□ WP50G	50g	25g	10g	5g
□ BS5KG	5kg	2.5kg	1kg	500g	□ WP100G	100g	50g	25g	10g
□ BS20KG	20kg	10kg	5kg	2kg	□ WP200G	200g	100g	50g	25g
□ DS5KG	5kg	2.5kg	1kg	500g	□ WP500G	500g	250g	100g	50g
□ DS10KG	10kg	7.5kg	5kg	2.5kg	□ WP1KG	1kg	500g	250g	100g
□ DS50KG	50kg	40kg	20kg	10kg	□ WP5KG	5kg	2.5kg	1kg	500g
□ DS100KG	100kg	50kg	20kg	10kg	□ WP10KG	10kg	5kg	2.5kg	1kg
□ DS200KG	200kg	100kg	50kg	20kg	□ WP20KG	20kg	10kg	5kg	2kg
□ DS500KG	500kg	300kg	250kg	100kg	□ WP50KG	50kg	20kg	10kg	5kg
Pull Test Tweezers/ColdBump					Push Test-Down/Pull
Transducer	Auto Range				Transducer	Auto Range
□ TP100G	100g	50g	25g	10g	□ DP100G	100g	50g	25g	10g
□ TP1KG	1kg	500g	250g	100g	□ DP5KG	5kg	2.5kg	1kg	500g
□ TP5KG	5kg	2.5kg	1kg	500g	□ DP10KG	10kg	5kg	2.5kg	1kg
□ TP10KG	10kg	5kg	2.5kg	1kg	□ DP20KG	20kg	10kg	5kg	2kg
□ TP20KG	20kg	10kg	5kg	2kg	□ PP5KG	5kg	2.5kg	1kg	500g
□ CBP2.5KG	2.5kg	1kg	500g	250g	□ PP10KG	10kg	5kg	2.5kg	1kg
□ CBP5KG	5kg	2.5kg	1.25kg	500g	□ PP50KG	50kg	25kg	10kg	5kg
Key Specifications
Model		WBE-9088C
Test Stations		1-6 modular units
XY-Axis Travel		500×500 mm (±0.1μm accuracy)
Z Axis Travel		100 mm (±0.1μm @≤2mm)
Resolution		0.1 μm (all axes)
Max Speed		XY: 7 mm/s Z: 10 mm/s
Max Test Force		Y: 200 kg Z: 20 kg
Max Test Force		Y: 200 kg Z: 20 kg
Transducer Accuracy		±0.1% Full Scale (FS)
Fixture Platform		Universal quick-change interface 360° rotational capability
Optical Inspection		1-60x HD zoom microscope
Vision Upgrade		HD CCD camera option
Calibration System		Radial calibration targets & certified weights set
Vacuum Supply		550 mm Hg (73.3 kPa)
Compressed Air		4.5~6 bar (65~87 psi)
Power Supply		110V/220V ±5%, 50/60 Hz, 1kW (4.5A)
Dimensions (W×D×H)		1200 × 900 × 1550 mm
Weight		195kg
Software		Integrated Windows 11 PC Real-time data logging & export (CSV/PDF/TXT)

【💡：Learn More】

Send Us A Message

WBE-9088C/PCB Large Sample Bond Tester Machine

WBE-9088C/PCB Large Sample Bond Tester Machine

Send Us A Message