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Guangdong WBE Instrument Technology Co., Ltd., abbreviated as WBE, was founded in 1995 and is headquartered in Dongguan, Guangdong Hong Kong Macao Greater Bay Area. It is a high-end testing instrument manufacturer. The company currently has over 12000 square meters of modern independent factories to meet various non-standard customized production needs, and has established five marketing service centers in Beijing, Chongqing, Xi'an, Suzhou, Dongguan and other places across the country, aiming to provide customers with more convenient and efficient services. Our products include various weather resistant environmental testing chambers, large-scale non-standard environmental testing chambers, chip packaging push-pull testing machines, and comprehensive mechanical and environmental non-standard testing machines.
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The main tests performed by a push-pull testing machine include wire bond pull testing (to check the strength of wire-to-pad bonds), ball shear testing (to test the integrity of solder balls in BGA packages), die shear testing (to measure the adhesion strength of a semiconductor die to its substrate), and various other micro-force tests like tweezer pull or stud pull for specific components.
A push-pull testing machine is essential for semiconductors because it directly validates the reliability of the packaging process. A single faulty wire bond or a weak die attachment can cause a catastrophic failure of an entire integrated circuit. These machines provide the data needed for process control, quality assurance, and compliance with industry standards like MIL-STD-883.
A destructive pull test, the more common type, pulls a wire until it breaks to measure its ultimate bond strength. A non-destructive pull test, performed on a push-pull testing machine, applies a predetermined force (lower than the expected breaking strength) to 100% of the wires on a high-reliability device. This ensures all bonds meet a minimum strength requirement without destroying them.
The force range for a push-pull testing machine is typically very low, often from a few grams-force (gf) up to 100 kilograms-force (kgf). Different test heads and load cell cartridges are used to achieve high accuracy within specific ranges, such as 0-100 gf for fine wire pull testing or 0-100 kgf for die shear testing.
By providing immediate feedback on the quality of the bonding or soldering process, a push-pull testing machine helps engineers identify and correct process issues quickly. If bond strengths start to trend lower, it can indicate a problem with a wire bonder, a contaminated surface, or an incorrect parameter. Addressing these issues in real-time prevents the production of large quantities of faulty devices, thus improving overall yield.
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